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50.7*50.7*5.60mm Custom IC Chip Tray for Chips of Various Sizes

50.7*50.7*5.60mm Custom IC Chip Tray for Chips of Various Sizes

الاسم التجاري: Hiner-pack
رقم الطراز: HN24046
الـ MOQ: 1000
السعر: TBC
شروط الدفع: 100% Prepayment
القدرة على التوريد: 2000PCS/Day
معلومات مفصلة
مكان المنشأ:
شنتشن ، الصين
إصدار الشهادات:
ROHS
شكل:
مستطيل
مصفوفة الكمية:
5*4 = 20pcs
عمر العفن:
30 ~ 45000 مرة
متينة:
نعم
مقاومة السطح:
1.0x10E4 ~ 1.0x10E11Ω
يستخدم:
النقل ، التخزين ، التعبئة
قالب الحقن:
المهلة 10 ~ 15days
تصميم:
قياسي وغير قياسي
Packaging Details:
500 Pcs/carton(According To Actual Packing)
Supply Ability:
2000PCS/Day
إبراز:

30-45 mold life IC chip tray,hard integrated circuit IC tray,PCB assembly IC chip tray

,

hard integrated circuit IC tray

,

PCB assembly IC chip tray

وصف المنتج

Product Description:

    Available in both standard and non-standard designs, this product is essential for maintaining a clean and organized work environment in electronics manufacturing facilities.With a lead time of 10 to 15 days for injection mold production, this IC Chip Tray boasts a quick turnaround time to meet your urgent storage needs. The IC Chip Tray provides a secure and systematic way to store IC chips, preventing damage and loss. The tray is specially designed to accommodate IC chips of various sizes and configurations, making it a versatile solution for different types of electronic components.

Technical Parameters:

Molding Method Injection Moulding
Surface Resistance 1.0x10E4~1.0x10E11Ω
Origin China
Function Organize And Store IC Chips
Shape Rectangular
Use Transport, Storage, Packing
Matrix Qty 5*4=20PCS
Injection Mold Lead Time 15~20Days
Design Standard And Non-standard
Durable Yes

Applications:

♠Chip Packaging and Testing: Used to securely hold and transport ICs during(packaging) and(testing) processes, preventing electrostatic discharge (ESD) and physical damage.

♠Automated Assembly Lines: Integrated with robotic systems for precise chip placement, ensuring compatibility with pick-and-place machines in SMT (Surface Mount Technology) processes.


Packing and Shipping:

♠Packing:

Use anti-static packaging box to tightly pack the product, ensure that the product will not be affected in the process of transportation.

♠Shipping:

Dispatch the packages on time to meet the scheduled delivery dates.