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| الاسم التجاري: | Hiner-pack |
| رقم الطراز: | HN24139 |
| الـ MOQ: | 500pcs |
| السعر: | $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities） |
| شروط الدفع: | 100% Prepayment |
| القدرة على التوريد: | 2000PCS/Day |
Precision JEDEC IC Trays Tailored For IC Chip Production In Semiconductor
The High Precision JEDEC Matrix Tray is engineered to deliver exceptional dimensional accuracy and stability for semiconductor packaging and component handling. Designed to meet JEDEC global standards, it offers a reliable solution for transporting, testing, and storing delicate devices within automated environments. Each pocket maintains precise geometry, ensuring components stay aligned and protected during multi-step production flows. The tray’s ESD-safe material provides consistent anti-static performance while withstanding long-term use in cleanroom and production settings.
High Dimensional Accuracy – Maintains tight tolerances across all pockets, ensuring reliable component positioning in high-speed automation.
Global JEDEC Compatibility – Fully compliant with JEDEC standards for smooth interchangeability across equipment and supply chains.
Static Dissipative Performance – Stable ESD protection prevents electrostatic damage to sensitive devices.
Smooth Pocket Surface – Minimizes friction and particle generation during automated loading and unloading.
Structural Integrity – Reinforced frame enhances tray rigidity and prevents warping under operational stress.
Stackable Design – Interlocking edges allow secure stacking for compact storage and efficient logistics.
| Brand | Hiner-pack |
| Model | HN24139 |
| Material | MPPO |
| Package Type | IC Component |
| Color | Black |
| Resistance | 1.0x10e4-1.0x10e11Ω |
| Outline Line Size | 322.6x135.9x12.19mm |
| Cavity Size | 30.4x15.5x7.65mm |
| Matrix QTY | 6*8=48PCS |
| Flatness | MAX 0.76mm |
| Service | Accept OEM, ODM |
| Certificate | RoHS, IOS |
The High Precision JEDEC Matrix Tray can be customized for unique production demands and specialized device geometries:
Tailored Pocket Designs – Adjust pocket shape and depth to suit varied device outlines or thicknesses.
Color Customization – Available in multiple ESD-safe color variants to support line management and batch identification.
Integrated Identification – Include molded markings or embedded codes for traceability and process control.
Automation-Ready Enhancements – Optional edge and corner modifications ensure compatibility with proprietary automation interfaces or specialized robotic systems.
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