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Injection Moulding JEDEC Matrix Tray For Fast Production And Standardized IC Component Handling

Injection Moulding JEDEC Matrix Tray For Fast Production And Standardized IC Component Handling

الاسم التجاري: Hiner-pack
رقم الطراز: HN24120
الـ MOQ: 500pcs
السعر: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
شروط الدفع: 100% Prepayment
القدرة على التوريد: 2000PCS/Day
معلومات مفصلة
مكان المنشأ:
شنتشن الصين
إصدار الشهادات:
RoHS、ISO
مصفوفة:
8*18 = 144pcs
إنكوترمز:
EXW ، FOB ، CIF ، DDU ، DDP
ملكية:
ESD ، غير ESD
مادة:
MPPO
معادٍ:
نعم
طريقة صب:
صب الحقن
قابل للتكديس:
نعم
Packaging Details:
70~100pcs/carton(According To The Customer Demand)
Supply Ability:
2000PCS/Day
إبراز:

Injection Moulding JEDEC Matrix Tray,Fast Production JEDEC Tray,MPPO Material Matrix Tray

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Fast Production JEDEC Tray

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MPPO Material Matrix Tray

وصف المنتج
Anti-Static Injection Moulding for Output and Fast Production
Product Description
JEDEC (Joint Electronic Device Engineering Council) - www.jedec.org - is responsible for creating open standards in the microelectronics industry. These standards ensure product interoperability, benefiting both the industry and consumers by reducing product development time and costs while increasing efficiency and productivity. JEDEC trays all adhere to the same size, standardized outline, and required features.
Placing parts in a JEDEC tray guarantees that your components can be easily processed in industry-standard automation equipment, including pick and place machines, inspection tools, laser marking devices, testing equipment, and dispensing tools. It is simple to integrate commercially available JEDEC tray feeders into custom process machines.
The maximum baking temperature is clearly marked on JEDEC trays. Exceeding this specified temperature during baking can lead to alterations in the tray's dimensions and potentially harm the contents. The tray's maximum temperature rating is determined by the type of molding compound utilized during manufacturing.
Features
  • JEDEC trays are custom designed and manufactured, often device and manufacturer specific
  • Component footprint for PCB layout is more tightly controlled than packaging
  • Off-the-shelf options available for high-demand custom trays
  • Open-tooled custom molds available with minimum quantity requirements
Technical Parameters
Parameter Value
Brand Hiner-pack
Outline Line Size 322.6x135.9x7.62mm
Model HN24120
Cavity Size 15.9*10.3*2.6mm
Material MPPO
Matrix QTY 8*14=112PCS
Package Type IC Component
Flatness MAX 0.76mm
Color Black
Resistance 1.0x10e4-1.0x10e11Ω
Certificate RoHS, IOS
Applications
Packaging: JEDEC trays function as containers with stacking features for efficient storage.
Transportation & Storage: Ideal for safe transport of components locally or internationally.
Protection: Provides mechanical and electrostatic discharge (ESD) protection.
Standardization: Offers compatibility with most semiconductor and PC board manufacturing equipment.