JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging

JEDEC Tray For BGA/QFN/DIP And Custom Fit For IC Component Packaging

Engineered for precision and reliability, this JEDEC matrix tray delivers consistent performance across semiconductor manufacturing, testing, and packaging processes. Its robust, ESD-safe polymer body resists deformation while maintaining uniform pocket alignment, enabling flawless compatibility with automated feeders and robotic pick-and-place systems. The tray’s thoughtful geometry and smooth surface finish promote safe handling of delicate microelectronic parts, ensuring both process efficiency and component protection throughout the production chain.

Features & Benefits:

JEDEC-Compliant Outline – Universal compatibility with global tray feeders, elevators, and conveyor systems for easy integration.

ESD-Safe Construction – Conductive polymer materials safeguard sensitive parts from static build-up during transport or assembly.

Precision Pocket Layout – Accurately molded pocket arrays ensure reliable part retention and positioning for high-speed automation.

Visual & Mechanical Orientation Aids – Chamfered corners, alignment notches, and pickup recesses allow rapid identification and error-free robotic handling.

Stacking Reliability – Interlocking rims stabilize multiple trays in vertical stacks, maintaining alignment and minimizing shifting.

Operational Longevity – Maintains mechanical integrity and dimensional stability under repeated handling, cleaning, and controlled heating cycles.

Technical Parameters:

Applications:

Packaging – at their core, trays are simply containers. The JEDEC tray outline includes features for stacking, whereby each successive tray becomes the cover for the tray below.

Transportation & Storage – parts loaded into stacked JEDEC trays are easy to store or transport, across the room or around the world. JEDEC trays also function as process “boats”, transporting their contents through a variety of process tools and equipment.

Protection  – JEDEC trays protect the parts they hold from mechanical damage. Most JEDEC trays are manufactured using materials that also provide electrical protection from electrostatic discharge (ESD) damage.

Customization:

Versatile customization options are available to align the tray design with specific product or process needs:

Custom Pocket Geometry – Adapt pocket size, contour, and spacing to match non-standard component shapes or unique packaging styles.

Color Variations – Offer ESD-compliant colors for production line differentiation or inventory management.

Embedded Mold Details – Include raised logos, serial codes, or internal batch identifiers for efficient product tracking.

System Interface Enhancements – Add guide slots, support pins, or extended edges to suit proprietary automation or feeder systems.