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Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

Professional ESD Waffle Trays for Fine Pitch IC Components with Anti-Static & Dust-Proof Design and Customizable Cavity Size

الاسم التجاري: Hiner-pack
رقم الطراز: HN24191
الـ MOQ: 500 قطعة
السعر: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
شروط الدفع: تي/تي
القدرة على التوريد: 2000 قطعة/يوم
معلومات مفصلة
مكان المنشأ:
الصين
إصدار الشهادات:
ROHS, ISO
وزن الدرج:
يختلف، عادةً ما يصل إلى 500 جرام لكل تجويف
لون:
أسود
ضمان الجودة:
ضمان التسليم والجودة الموثوقة
حجم الخط التفصيلي:
50.8×50.8×3.94 ملم
حجم التجويف:
8.76x5.51x0.685 ملم
مصطلحات التجارة الدولية:
EXW ، FOB ، CIF ، DDU ، DDP
نوع القالب:
حقن
قابلة لإعادة الاستخدام:
نعم
شكل صينية:
مستطيلة
فئة نظيفة:
التنظيف العام والموجات فوق الصوتية
نوع آي سي:
بغا، QFP، QFN، LGA، PGA
مستوى التعبئة:
حزمة النقل
صفحة الحرب:
Warpage ماكس 0.26 ملم
سعة:
4 × 6 = 24 قطعة
تفاصيل التغليف:
الكرتون، البليت
القدرة على العرض:
2000 قطعة/يوم
إبراز:

Fine Pitch IC Components ESD Waffle Trays

,

Anti-Static & Dust-Proof Waffle Pack Chip Trays

,

Customizable Cavity Size IC Component Trays

وصف المنتج
Professional ESD Waffle Trays for Fine Pitch IC Components
Features precision waffle structure to hold fine pitch ICs stably. Effectively blocks particulate contamination and avoids ESD damage during whole process. Made of durable anti-static material to maintain stable performance in various working conditions.

Matches well with automatic production and processing lines. Works smoothly in chip loading, transferring and sorting. Improves operation efficiency and ensures component integrity in daily production.

Accepts full customization on cavity size and arrangement to fit different components. Focuses on safe protection and efficient packaging. Provides professional solutions for high-precision semiconductor applications.
Key Features/ Benefits 
  • Anti-static & dust-proof design for safe chip handling
  • Offers stable cleanroom-grade contamination control
  • Stable component holding
  • Protects delicate fine pitch IC components efficiently
  • Support fully customized cavity sizes and layout designs
  • Precise waffle structure.
Specifications
Brand Hiner-pack
Model HN24191
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.8×50.8×3.94 mm
Cavity Size 8.76x5.51x0.685 mm
Matrix QTY 4x6=24 PCS
Warpage MAX 0.26mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for high-precision chip processing, component sorting, chip testing and small device assembly. Works well in automatic production lines and static controlled workshops.

Ideal for factory internal transportation, finished product storage and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants and electronic component suppliers.
Packaging & Shipping/ Services
Supports customized packaging plans to ensure safe delivery. Protects trays from deformation and damage during long distance transportation.

Provides stable and reliable packaging solutions for bulk orders. Helps maintain product quality and arrives in good condition for customers.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers